• DocumentCode
    2499397
  • Title

    Recessed Y-gate AlN/GaN/AlGaN DHFET with GaN cap layer at the gate edge

  • Author

    Khan, Mohammad ; Maruf, H.M.M. ; Ahmed, Mariwan ; Choudhury, M.A.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., BUET, Bangladesh
  • fYear
    2012
  • fDate
    6-7 June 2012
  • Firstpage
    302
  • Lastpage
    305
  • Abstract
    We have proposed and simulated recessed Y-gate AlN/GaN/AlGaN DHFET structure with GaN cap layer at drain side of the gate as well as compared its simulated characteristics with the conventional DHFET. The threshold voltage of the proposed device was increased 0.2V to the positive side. Use of GaN cap at the gate side-wall effectively reduced electric field concentration at the gate edge of the proposed device compared to the conventional one, which also ensured the leakage current of the proposed device was 1 order less than that of conventional device. The forward characteristics of proposed device are slightly degraded due to the recessed gate structure which entered the channel region and 1-nm thin layer of AlN layer.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; AlN-GaN-AlGaN; cap layer; channel region; drain side; electric field concentration; gate edge; gate side wall; leakage current; recessed gate structure; simulated recessed Y-gate DHFET; size 1 nm; threshold voltage; Aluminum gallium nitride; DH-HEMTs; Electric fields; Gallium nitride; Logic gates; MODFETs; AlN/GaN/AlGaN double-heterostructure field-effect transistor (DHFET); enhancement-mode device; power device; recessed gate structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Engineering and Optimization Conference (PEDCO) Melaka, Malaysia, 2012 Ieee International
  • Conference_Location
    Melaka
  • Print_ISBN
    978-1-4673-0660-7
  • Type

    conf

  • DOI
    10.1109/PEOCO.2012.6230879
  • Filename
    6230879