DocumentCode
2499397
Title
Recessed Y-gate AlN/GaN/AlGaN DHFET with GaN cap layer at the gate edge
Author
Khan, Mohammad ; Maruf, H.M.M. ; Ahmed, Mariwan ; Choudhury, M.A.
Author_Institution
Dept. of Electr. & Electron. Eng., BUET, Bangladesh
fYear
2012
fDate
6-7 June 2012
Firstpage
302
Lastpage
305
Abstract
We have proposed and simulated recessed Y-gate AlN/GaN/AlGaN DHFET structure with GaN cap layer at drain side of the gate as well as compared its simulated characteristics with the conventional DHFET. The threshold voltage of the proposed device was increased 0.2V to the positive side. Use of GaN cap at the gate side-wall effectively reduced electric field concentration at the gate edge of the proposed device compared to the conventional one, which also ensured the leakage current of the proposed device was 1 order less than that of conventional device. The forward characteristics of proposed device are slightly degraded due to the recessed gate structure which entered the channel region and 1-nm thin layer of AlN layer.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; AlN-GaN-AlGaN; cap layer; channel region; drain side; electric field concentration; gate edge; gate side wall; leakage current; recessed gate structure; simulated recessed Y-gate DHFET; size 1 nm; threshold voltage; Aluminum gallium nitride; DH-HEMTs; Electric fields; Gallium nitride; Logic gates; MODFETs; AlN/GaN/AlGaN double-heterostructure field-effect transistor (DHFET); enhancement-mode device; power device; recessed gate structure;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Engineering and Optimization Conference (PEDCO) Melaka, Malaysia, 2012 Ieee International
Conference_Location
Melaka
Print_ISBN
978-1-4673-0660-7
Type
conf
DOI
10.1109/PEOCO.2012.6230879
Filename
6230879
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