• DocumentCode
    2499563
  • Title

    Multi-wafer MOCVD growth of highly uniform InGaAsP strained quantum well structure for low threshold 1.3 μm lasers

  • Author

    Mori, K. ; Takemi, M. ; Takiguchi, T. ; Goto, K. ; Nishimura, T. ; Kimura, T. ; Mihashi, Y. ; Murotani, T.

  • Author_Institution
    Mitsubishi Electric Corp., Itami, Hyogo, Japan
  • fYear
    1993
  • fDate
    19-22 Apr 1993
  • Firstpage
    235
  • Lastpage
    238
  • Abstract
    The authors demonstrated a successful multi-wafer growth for the 1.3 μm InGaAsP strained multiple quantum well (MQW) lasers. Excellent uniformity of composition and thickness was realized by optimizing the growth conditions. The standard deviation of photoluminescence (PL) wavelength of InGaAsP layer over a 2 inch wafer is 4 nm, which is the lowest value for the multi-wafer growth. For a strained MQW structure, the standard deviation in PL wavelength of 7nm has been obtained. Buried-heterostructure lasers have been fabricated using the multi-wafer metal-organic chemical vapor deposition growth. The lasers exhibit very low threshold current over wide temperature range and low operating current of 26 mA was obtained even at 80°C with 5 mW continuous wave (CW) output
  • Keywords
    CVD coatings; III-V semiconductors; gallium arsenide; gallium compounds; indium compounds; quantum well lasers; semiconductor growth; semiconductor heterojunctions; vapour phase epitaxial growth; 1.3 micron; 2 in; 4 nm; InGaAsP; MOCVD growth; buried heterostructure laser; highly uniform InGaAsP strained quantum well structure; low threshold 1.3 μm lasers; multiple quantum well; semiconductor; Fiber lasers; Indium phosphide; Inductors; Lattices; MOCVD; Masers; Microwave devices; Quantum well devices; Quantum well lasers; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1993. Conference Proceedings., Fifth International Conference on
  • Conference_Location
    Paris
  • Print_ISBN
    0-7803-0993-6
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1993.380667
  • Filename
    380667