DocumentCode
2500523
Title
An investigation into the effects of thermal annealing on long wavelength InGaAs/InGaAsP multi-quantum well lasers
Author
Vettese, C. ; Harrison, I. ; Benson, T.M. ; Robertson, M.J. ; Murrell, D.
Author_Institution
Dept. of Electr. & Electron. Eng., Nottingham Univ., UK
fYear
1993
fDate
19-22 Apr 1993
Firstpage
40
Lastpage
43
Abstract
Multi-quantum well (MQW) inter-mixing was achieved through a set of controlled thermal anneals and were performed on a range of strained and unstrained InGaAs/InGaAsP MQW systems to establish the role of strain in the interdiffusion process. The exposure to high temperatures, as is the case in many fabrication and growth processes, can cause the inter-diffusion of both group V and III species throughout the MQW region. The variation in compositional concentration from the as-grown regime causes lattice mismatch, and thus strain, at the heterostructure interfaces. This intermixing alters the material structure and can affect device performance. The investigation was extended to assess the effects of MQW inter-mixing on the performance of 1.5μm lasers. Room temperature photoluminescence analysis was used in the characterization of the inter-mixing process and results are presented
Keywords
III-V semiconductors; annealing; chemical interdiffusion; gallium arsenide; gallium compounds; indium compounds; internal stresses; photoluminescence; quantum well lasers; 1.5 micron; InGaAs/InGaAsP multi-quantum well lasers; MQW region; as-grown regime; characterization; compositional concentration; device performance; fabrication; growth processes; heterostructure interfaces; high temperatures; inter-mixing; interdiffusion process; lattice mismatch; long wavelength; performance; photoluminescence analysis; strain; thermal annealing; Annealing; Capacitive sensors; Control systems; Fabrication; Indium gallium arsenide; Lattices; Optical materials; Quantum well devices; Strain control; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 1993. Conference Proceedings., Fifth International Conference on
Conference_Location
Paris
Print_ISBN
0-7803-0993-6
Type
conf
DOI
10.1109/ICIPRM.1993.380715
Filename
380715
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