Title :
Overall equipment effectiveness (OEE) and cost measurement [semiconductor manufacturing]
Author :
Konopka, John ; Trybula, Walt
Author_Institution :
SEMATECH, Austin, TX, USA
Abstract :
Total Productive Maintenance (TPM) has provided a new perspective on semiconductor manufacturing. The need to improve performance requires more focus than ever on the TPM metric of Overall Equipment Effectiveness (OEE). Investigation of this data with a productivity analysis framework called the Capacity Utilization Bottleneck Efficiency System (CUBES) identifies and prioritizes productivity inefficiencies with their accompanying tool capacity decreases. A proposal for an extension of the CUBES to reflect cost measurement associated with these inefficiencies is discussed
Keywords :
costing; economics; human resource management; integrated circuit manufacture; semiconductor device manufacture; CUBES; Capacity Utilization Bottleneck Efficiency System; cost measurement; overall equipment effectiveness; productivity analysis framework; semiconductor manufacturing; tool capacity reduction; total productive maintenance; Availability; Control systems; Costs; Electronics industry; Performance loss; Production; Productivity; Proposals; Semiconductor device manufacture; Throughput;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3642-9
DOI :
10.1109/IEMT.1996.559707
