Title :
Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system
Author :
Sterken, Tom ; Vanfleteren, Jan ; Torfs, Tom ; Op de Beeck, M. ; Bossuyt, Frederick ; Van Hoof, Chris
Author_Institution :
Center for Microsyst. Technol. (CMST), Ghent Univ., Ghent, Belgium
fDate :
Aug. 30 2011-Sept. 3 2011
Abstract :
A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies.
Keywords :
electrocardiography; interconnections; UTCP; UltraThin Chip Package; electronic packaging; interconnection; stretchable circuit technology; wearable ECG system; wireless ECG monitoring system; Biomedical monitoring; Electrocardiography; Electrodes; Flexible printed circuits; Integrated circuit interconnections; Packaging; Polyimides; Clothing; Electric Conductivity; Electrocardiography; Electrocardiography, Ambulatory; Electrodes; Electronics; Equipment Design; Humans; Miniaturization; Monitoring, Physiologic; Polymers; Signal Processing, Computer-Assisted; Skin; Telemetry;
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2011.6091734
