• DocumentCode
    2501411
  • Title

    The use and evaluation of rapid screening method

  • Author

    Yingsuo, Zhang ; Ye, Wan

  • Author_Institution
    Xi´´an Inst. of Insulating Mater., China
  • fYear
    1998
  • fDate
    27-30 Sep 1998
  • Firstpage
    733
  • Lastpage
    736
  • Abstract
    This paper shows that there is an intimate relation between the TG data and long term thermal endurance of dielectrics. TG curves are able to reveal the thermochemical stability of the dielectrics and are main factors governing their thermal capability. But, they are in principle different from the thermal endurance properties of insulating materials again. This is chiefly because TG data are lacking in the functionality, that is, can not reflect the physical thermostability of materials, further, both reaction mechanisms have a certain differences as well. The paper still gives the comparison between rapid thermal endurance test methods and conventional aging method, and analyzes why errors of Cut line method are excessive
  • Keywords
    ageing; insulation testing; thermal analysis; thermal stability; Cut line method; conventional aging; dielectric testing; insulating material; rapid screening method; reaction mechanism; thermal endurance; thermochemical stability; thermogravimetric analysis; Aging; Chemicals; Dielectric losses; Dielectric materials; Fabrics; Polymers; Resists; Temperature; Testing; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on
  • Conference_Location
    Toyohashi
  • Print_ISBN
    4-88686-050-8
  • Type

    conf

  • DOI
    10.1109/ISEIM.1998.741850
  • Filename
    741850