DocumentCode
2501411
Title
The use and evaluation of rapid screening method
Author
Yingsuo, Zhang ; Ye, Wan
Author_Institution
Xi´´an Inst. of Insulating Mater., China
fYear
1998
fDate
27-30 Sep 1998
Firstpage
733
Lastpage
736
Abstract
This paper shows that there is an intimate relation between the TG data and long term thermal endurance of dielectrics. TG curves are able to reveal the thermochemical stability of the dielectrics and are main factors governing their thermal capability. But, they are in principle different from the thermal endurance properties of insulating materials again. This is chiefly because TG data are lacking in the functionality, that is, can not reflect the physical thermostability of materials, further, both reaction mechanisms have a certain differences as well. The paper still gives the comparison between rapid thermal endurance test methods and conventional aging method, and analyzes why errors of Cut line method are excessive
Keywords
ageing; insulation testing; thermal analysis; thermal stability; Cut line method; conventional aging; dielectric testing; insulating material; rapid screening method; reaction mechanism; thermal endurance; thermochemical stability; thermogravimetric analysis; Aging; Chemicals; Dielectric losses; Dielectric materials; Fabrics; Polymers; Resists; Temperature; Testing; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on
Conference_Location
Toyohashi
Print_ISBN
4-88686-050-8
Type
conf
DOI
10.1109/ISEIM.1998.741850
Filename
741850
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