DocumentCode
2501918
Title
FDTD analysis on the current and electric field distribution in a PCB stripline structure
Author
Kim, Yung-Kyu
Author_Institution
EMC Dept., Radio Res. Lab., Yongsan, South Korea
Volume
2
fYear
2000
fDate
2000
Firstpage
691
Abstract
An FDTD analysis is reported on changes in distributions of the stripline current, image current and electric field in a PCB stripline structure of stripline-dielectric-ground plane as the dielectric thickness and stripline width are varied and these distributions are described graphically. As the ratio of the stripline width w to the dielectric thickness h, w/h, went to greater than 1, the stripline current was distributed on the bottom side of the stripline, the image current was concentrated just under its corresponding stripline, and most of the emitted field produced by the stripline was confined within the dielectric. As the ratio went to less than 1, the stripline current started being distributed on all the outer surface of the stripline, the image current was more spread in its width, and more emitted field came out of the dielectric. Variation of w/h from 0.1 to 2 caused only a little change in the stripline current and electric field intensity inside the dielectric, but the field is much reduced outside both in intensity and spatially, which means that decrease in the dielectric thickness could raise the PCB circuit density
Keywords
current distribution; electric fields; electromagnetic interference; finite difference time-domain analysis; printed circuit design; strip lines; EMI; FDTD analysis; PCB design; PCB stripline structure; current distribution; dielectric thickness; electric field distribution; electric field intensity; emitted field; image current; stripline current; stripline width to dielectric thickness ratio; stripline-dielectric-ground plane; Circuits; Crosstalk; Dielectrics; Finite difference methods; Frequency; Image analysis; Interference; Maxwell equations; Stripline; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location
Washington, DC
Print_ISBN
0-7803-5677-2
Type
conf
DOI
10.1109/ISEMC.2000.874704
Filename
874704
Link To Document