• DocumentCode
    2502255
  • Title

    Top-emitting 980-nm vertical-cavity surface-emitting laser diodes with improved optical power

  • Author

    Al-Omari, A.N. ; Alias, M.S. ; Lear, K.L.

  • Author_Institution
    Electron. Eng. Dept., Yarmouk Univ. Irbid, Irbid, Jordan
  • fYear
    2012
  • fDate
    1-3 Oct. 2012
  • Firstpage
    76
  • Lastpage
    79
  • Abstract
    Top-emitting, oxide-confined, polyimide-planarized 980-nm VCSELs with copper-plated heatsinks were fabricated and characterized. Increasing the plated heatsink radius from 0-μm to 4-μm larger than the mesa diameter for lasers with 8-μm oxide aperture diameter reduced the measured thermal impedance, increased the maximum bias current density, and increased the maximum output optical power achieved by a 29%, 37%, and 73%, respectively. VCSELs with oxide aperture diameter and heatsink overlap of 8-μm and 4-μm, respectively, demonstrated 17°C decrease in the internal device temperature (i.e. active region temperature) at the maximum output optical power. Devices with similar mesa diameters of 26-μm and different heatsink overlaps exhibited a threshold bias current and a total series resistance of (630±4%)μA and ~95Ω, respectively.
  • Keywords
    copper; current density; heat sinks; laser beams; laser cavity resonators; optical fabrication; optical polymers; semiconductor lasers; surface emitting lasers; active region temperature; copper-plated heatsinks; internal device temperature; maximum bias current density; maximum output optical power; mesa diameter; oxide aperture diameter; radius 0 mum to 4 mum; size 8 mum; thermal impedance; threshold bias current; top-emitting oxide-confined polyimide-planarized VCSEL; top-emitting vertical-cavity surface-emitting laser diodes; total series resistance; wavelength 980 nm; Apertures; Heat sinks; Optical device fabrication; Resistance; Temperature measurement; Vertical cavity surface emitting lasers; Cu-plated; Laser diodes; Thermal resistance. Semiconductor lasers; VCSELs; metal heatsinks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics (ICP), 2012 IEEE 3rd International Conference on
  • Conference_Location
    Penang
  • Print_ISBN
    978-1-4673-1461-9
  • Type

    conf

  • DOI
    10.1109/ICP.2012.6379873
  • Filename
    6379873