Thermomechanical behaviour of adhesive jointed SMT components

Author

Périchaud, M.G. ; Delétage, J.Y. ; Carboni, D. ; Frémont, H. ; Danto, Y. ; Faure, C.

Author_Institution

IXL, Talence, France

fYear

1998

fDate

28-30 Sep 1998

Firstpage

55

Lastpage

61

Abstract

This paper compares the efficiency of two thermosetting and one thermoplastic conductive adhesives for SMT assemblies. Their reliability is evaluated during accelerated life tests through electrical and mechanical measurements. The contact metallizations are taken into account. Finite element simulations confirm the experimental results, and a parametric study allows us to define some choice criteria for the physical properties of the adhesives

Keywords

adhesives; circuit reliability; circuit testing; conducting polymers; electrical contacts; finite element analysis; life testing; metallisation; surface mount technology; SMT assemblies; accelerated life tests; adhesive jointed SMT components; adhesive physical properties; adhesives; contact metallization; electrical measurements; finite element simulations; mechanical measurements; reliability; thermomechanical behaviour; thermoplastic conductive adhesives; thermosetting conductive adhesives; Assembly; Conductive adhesives; Contacts; Electric variables measurement; Life estimation; Life testing; Mechanical variables measurement; Metallization; Surface-mount technology; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742003

Filename

742003