Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

Author

Constable, J.H. ; Kache, Thomas ; Teichmann, Heiko ; Mühle, Sven ; Gaynes, Michael A.

Author_Institution

State Univ. of New York, Binghamton, NY, USA

fYear

1998

fDate

28-30 Sep 1998

Firstpage

76

Lastpage

83

Abstract

Four isotropically conducting adhesives were used to form lap joints between copper fingers which had been prepared with four surface metallizations (Cu, Au, Pd, and PdNi). A micromechanical tester was used to perform pull and fatigue tests on the 16 adhesive/finish combinations. The micro-ohm resistance change was measured during both the pull and fatigue tests. The similarities and differences between the mechanical strength, fatigue life, and resistance change for the 16 adhesive/finish combinations are reported, and conclusions are drawn about relative motion between silver particles and the fracture interfaces

Keywords

adhesives; conducting polymers; contact resistance; fatigue testing; filled polymers; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit testing; mechanical strength; mechanical testing; monitoring; Ag; Au surface metallization; Au-Cu; Cu; Cu surface metallization; Pd surface metallization; Pd-Cu; PdNi surface metallization; PdNi-Cu; adhesive/finish combinations; continuous electrical resistance monitoring; copper fingers; fatigue life; fatigue tests; fracture interfaces; isotropically conducting adhesives; isotropically conductive adhesive joints; lap joints; mechanical strength; micromechanical tester; pull strength; pull tests; relative motion; resistance change; silver particles; surface metallizations; Copper; Electric resistance; Fatigue; Fingers; Gold; Metallization; Micromechanical devices; Monitoring; Surface resistance; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742006

Filename

742006