Title :
Effect of bump height on flip-chip joint reliability using ACA
Author :
Persson, Katrin ; Lai, Zonghe ; Zribi, Anis ; Liu, Johan ; Willander, Magnus
Author_Institution :
Swedish Inst. of Production Eng. Res., Molndal, Sweden
Abstract :
There are many parameters that influence the quality and reliability of flip-chip joints assembled using anisotropically conductive adhesives. In this study, the influence of bump height has been investigated. Electroless nickel/gold bumps of 4, 20, 40 and 70 μm in height have been used. The chips have been assembled on FR-4 substrates using an anisotropically conductive adhesive and the samples have been subjected to temperature cycling from -40 to +125°C. It has been concluded that the bump height is of importance for flip-chip joint quality and reliability. Theoretical calculations have been conducted to find the relationship between joint mechanical strength and bump height at various distances from the centre of the chip
Keywords :
adhesives; conducting polymers; electroless deposition; filled polymers; flip-chip devices; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; mechanical strength; microassembling; -40 to 125 C; 20 micron; 4 micron; 40 micron; 70 micron; ACA; FR-4 substrates; Ni-Au; anisotropically conductive adhesives; bump height; bump height effects; electroless nickel/gold bump; flip-chip joint assembly; flip-chip joint quality; flip-chip joint reliability; joint mechanical strength; quality; reliability; temperature cycling; Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Electronics packaging; Failure analysis; Optical microscopy; Scanning electron microscopy; Substrates; Temperature;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742015
