DocumentCode
250394
Title
ThimbleSense: An individual-digit wearable tactile sensor for experimental grasp studies
Author
Battaglia, E. ; Grioli, G. ; Catalano, Manuel G. ; Santello, Marco ; Bicchi, A.
Author_Institution
Centro di Ricerca “E. Piaggio”, Univ. of Pisa, Pisa, Italy
fYear
2014
fDate
May 31 2014-June 7 2014
Firstpage
2728
Lastpage
2735
Abstract
Measuring contact forces applied by a hand to a grasped object is a necessary step to understand the mysteries that still hide in the unparalleled human grasping ability. Nevertheless, simultaneous collection of information about the position of contacts and about the magnitude and direction of forces is still an elusive task. In this paper we introduce a wearable device that addresses this problem, and can be used to measure generalized forces during grasping. By assembling two supports around a commercial 6-axis force/torque sensor we obtain a thimble that can be easily positioned on a fingertip. The device is used in conjunction with an active marker-based motion capture system to simultaneously obtain absolute position and orientation of the thimbles, without requiring any assumptions on the kinematics of the hand. Finally, using the contact centroid algorithm, introduced in [1], position of contact points during grasping are determined. This paper shows the design and implementation of the device, as well as some preliminary experimental validation.
Keywords
force sensors; grippers; mechanical contact; robot kinematics; tactile sensors; torque; 6-axis force/torque sensor; ThimbleSense; contact centroid algorithm; contact force; contact points; experimental grasp study; grasped object; hand kinematics; individual-digit wearable tactile sensor; marker-based motion capture system; simultaneous information collection; unparalleled human grasping ability; wearable device; Force; Force measurement; Grasping; Load modeling; Robot sensing systems; Solid modeling; Torque measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation (ICRA), 2014 IEEE International Conference on
Conference_Location
Hong Kong
Type
conf
DOI
10.1109/ICRA.2014.6907250
Filename
6907250
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