Title :
Simulation of a capacitive pressure sensor with VHDL-AMS
Author_Institution :
Semicond. & Microsystems Technol. Lab., Dresden Univ. of Technol., Germany
Abstract :
In this work a pressure sensor microsystem compatible with the standard CMOS-process is described using the simulation language VHDL-AMS. The system is composed of an array of micromachined membranes and a read-out circuit realized in switched-capacitor technology. The mechanical behavior of the individual membranes was represented using linear and nonlinear models. Three different realizations of the read-out circuit, whose objective is to provide linearization and amplification of the capacitance-pressure characteristic, were tested. Among them, a balanced modulator was designed specifically for this particular application. The employed circuits were validated with the circuit simulator program SPICE and ported to VHDL-AMS. Finally the complete multi-domain microsystem, composed of an array of capacitive membranes, linearization and amplification circuits and an analog-to-digital converter, was simulated under the same framework provided by the simulation language VHDL-AMS. The realizability of complex multi-physics, mixed-signal systems with the help of free simulators was demonstrated.
Keywords :
SPICE; capacitive sensors; circuit simulation; hardware description languages; microsensors; pressure sensors; switched capacitor networks; SPICE circuit simulator program; VHDL-AMS simulation language; balanced modulator; capacitance-pressure characteristics; capacitive membrane arrays; capacitive pressure sensor; mechanical behavior; mixed-signal simulation; multidomain microsystem; pressure sensor microsystem; read-out circuit; standard CMOS process; switched-capacitor technology; Biomembranes; CMOS technology; Capacitance-voltage characteristics; Capacitive sensors; Circuit simulation; Circuit testing; Mechanical sensors; SPICE; Sensor phenomena and characterization; Switching circuits;
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
DOI :
10.1109/ISSE.2003.1260473