DocumentCode :
2504003
Title :
Nanocomposite materials offer higher conductivity and flexibility [conducting polymers]
Author :
McCluskey, P. ; Nagvanshi, M. ; Verneker, V.R.P. ; Kondracki, Paul ; Finello, D.
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fYear :
1998
fDate :
28-30 Sep 1998
Firstpage :
282
Lastpage :
286
Abstract :
Until recently, all conductive polymers have fallen into one of the following two categories: intrinsically conductive polymers that exhibit poor processibility, low electrical conductivity, and thermal and chemical instability; and extrinsically (or particle filled) conductive polymers that exhibit high densities and poor flexibility. This paper describes the mechanical and electrical characteristics of a new type of conductive polymer made with conductive silver nanoparticle fillers. The use of nanoparticle fillers allows the material to attain the same level of conductivity exhibited by traditional filled polymers at significantly lower particle loading. This results in a conductive polymer that combines the high conductivity and stability of a filled polymer with the flexibility and low density of an intrinsically conductive polymer
Keywords :
conducting polymers; density; electrical conductivity; filled polymers; nanostructured materials; packaging; powder technology; silver; thermal stability; Ag; chemical instability; conducting polymers; conductive polymer; conductive polymers; conductive silver nanoparticle fillers; conductivity; electrical characteristics; electrical conductivity; extrinsically conductive polymers; filled polymers; flexibility; intrinsically conductive polymers; mechanical characteristics; nanocomposite materials; nanoparticle fillers; particle filled conductive polymers; particle loading; polymer density; polymer flexibility; processibility; thermal instability; Carbon; Conductivity; Electrostatic discharge; Polymers; Powders; Resistance; Rubber; Shape; Silver; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
Type :
conf
DOI :
10.1109/ADHES.1998.742041
Filename :
742041
Link To Document :
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