DocumentCode :
2504136
Title :
Studies of underfill formulation effects using molecular dynamics and discrete element modeling
Author :
Iwamoto, N. ; Li, M. ; McCaffery, S.J. ; Nakagawa, M. ; Mustoe, G.
Author_Institution :
Johnson Matthey Electron. Inc., San Diego, CA, USA
fYear :
1998
fDate :
28-30 Sep 1998
Firstpage :
321
Lastpage :
327
Abstract :
The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects
Keywords :
discharges (electric); encapsulation; filled polymers; finite element analysis; flow simulation; molecular dynamics method; packaging; surface chemistry; surface energy; voids (solid); binder effects; capillary action; controllable variables; discrete element modeling; dynamic interactions; filler effects; filler settling; filler striation; filling phenomenon; flow speed; formulation constituent effects; molecular dynamics modeling; molecular modeling; particle dynamics; surface energy; underfill formulation effects; underfill performance properties; underfill phenomenon; voiding; Adhesives; Atomic measurements; Drag; Filling; Fluid dynamics; Lubrication; Mechanical factors; Mechanical variables measurement; Power engineering and energy; Quantum mechanics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
Type :
conf
DOI :
10.1109/ADHES.1998.742048
Filename :
742048
Link To Document :
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