Title :
Through-Silicon Hole Interposers for 3-D IC Integration
Author :
Lau, John H. ; Ching-Kuan Lee ; Chau-Jie Zhan ; Sheng-Tsai Wu ; Yu-Lin Chao ; Ming-Ji Dai ; Ra-Min Tain ; Heng-Chieh Chien ; Jui-Feng Hung ; Chun-Hsien Chien ; Ren-Shing Cheng ; Yu-Wei Huang ; Yu-Mei Cheng ; Li-Ling Liao ; Wei-Chung Lo ; Ming-Jer Kao
Author_Institution :
Electron. & Optoelectron. Res. Lab., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
In this investigation, a system-in-package (SiP) that consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top and bottom sides (a real 3-D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of this SiP technology. The design, materials, and process of the top chip, bottom chip, TSH interposer, and final assembly will be presented. Shock and thermal cycling tests will be performed to demonstrate the integrity of the SiP structure.
Keywords :
system-in-package; test equipment; three-dimensional integrated circuits; 3D IC integration; TSH interposer; shock tests; system-in-package; test vehicle; thermal cycling tests; through-silicon hole interposers; Resists; Silicon; Substrates; Through-silicon vias; Tin; Vehicles; 2.5D/3D IC integration; interposer; re-distribution layer; through-silicon hole; through-silicon via;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2339832
