• DocumentCode
    2505092
  • Title

    Signal integrity face to face with EMC in PCB design

  • Author

    Pitica, Dan ; Lungu, S. ; Pop, Ovidiu

  • Author_Institution
    Dept. of Appl. Electron., Cluj-Napoca Tech. Univ., Romania
  • fYear
    2003
  • fDate
    8-11 May 2003
  • Firstpage
    278
  • Lastpage
    283
  • Abstract
    The paper presents a review of the most important phenomena that determine the signal integrity and EMC on the signal traces for the PCB equipped with digital circuits. The aim of this paper is to highlight the effects of variation of design parameters, signal integrity and EMC field. For all of the mentioned phenomena the mathematical models are specified. These models can be used in order to characterize the PCB signal traces and the way in which these models can be implemented in Matlab program. The Matlab simulated results and other electronics circuit simulator results (Pspice, Omega+) are compared. Based on this comparison, some observations about model performances and limitations can be done. Using these results, the paper analyses the effect that appears in signal integrity assurance and EMC, based on variation of some signal traces parameters. The conclusions of this paper are recommendation for signal traces design when digital circuits are used.
  • Keywords
    circuit simulation; digital circuits; electromagnetic compatibility; electronic engineering computing; printed circuit design; printed circuit testing; EMC field; Matlab program; Omega+; PCB design; Pspice; digital circuits; electronics circuit simulator; signal integrity; signal traces design; Circuit simulation; Digital circuits; Electromagnetic compatibility; Electronic circuits; Frequency; Integrated circuit interconnections; Mathematical model; Signal analysis; Signal design; Signal processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
  • Print_ISBN
    0-7803-8002-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2003.1260531
  • Filename
    1260531