Experimental study and modeling of microwave bond wire interconnects

Author

Sutono, A. ; Cafaro, N.G. ; Laskar, J. ; Tentzeris, E.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

4

fYear

2000

fDate

16-21 July 2000

Firstpage

2020

Abstract

We present a comprehensive characterization and study of various wire bond interconnect configurations for microwave integrated circuit packaging. Wire bond interconnects with two different bond types (ball-crescent and wedge), two different loop types (tight and loose) and various lengths are fabricated and experimentally characterized. We show the performance comparison of these configurations and develop an electromagnetic and a simple lumped-element equivalent circuit model.

Keywords

adhesion; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; lumped parameter networks; microwave integrated circuits; EM simulation; ball-crescent wire bond; electromagnetic circuit model; experimental study; loose loop wedge wire bond; lumped-element equivalent circuit model; microstrip lines; microwave bond wire interconnects; microwave integrated circuit packaging; performance comparison; tight loop wedge wire bonds; tight-loop ball-crescent wire bond; tight-loop wire bonds; Bonding; Electromagnetic modeling; Equivalent circuits; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Microstrip; Microwave integrated circuits; Microwave technology; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2000. IEEE

Conference_Location

Salt Lake City, UT, USA

Print_ISBN

0-7803-6369-8

Type

conf

DOI

10.1109/APS.2000.874889

Filename

874889