Title :
IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.02TH8619)
Abstract :
Presents the cover, society information and table of contents for the IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging (IEEE Cat. No.02TH8619).
Keywords :
circuit optimisation; clocks; digital integrated circuits; integrated circuit interconnections; integrated circuit modelling; packaging; power supply circuits; radiofrequency integrated circuits; bit rate; clock net design; digital integrated circuits; electrical parameter extraction; electromagnetic issues; electronic packaging; interconnection macromodeling; mm-wave applications; modeling; off chip package interconnections; on chip package interconnections; optimization issues; power distribution design; radiofrequency integrated circuits; synchronous interfaces; system design; transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057869
