• DocumentCode
    2505273
  • Title

    Unidirectional vs. simultaneous bidirectional source synchronous signaling

  • Author

    de Araujo, D.N. ; Cases, M. ; Pham, N. ; Dreps, D.

  • Author_Institution
    IBM Corp., Austin, TX, USA
  • fYear
    2002
  • fDate
    21-23 Oct. 2002
  • Firstpage
    7
  • Lastpage
    10
  • Abstract
    This paper describes a case study of electrical design optimization methodology for a high-speed point-to-point source-synchronous differential simultaneous bidirectional (SiBiDi) and unidirectional interface. Strengths and weaknesses of each signaling approach are explored and tradeoffs to optimize both are described. These physical links are typically used to interconnect multiple processor subsystems to build symmetric multi-processor (SMP) systems, as well as to connect input/output (I/O) subsystems across relative long distance.
  • Keywords
    circuit optimisation; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; multiprocessing systems; bidirectional source synchronous signaling; electrical design optimization methodology; high-speed interconnect design; input/output subsystems; multiple processor subsystems; physical links; point-to-point source-synchronous differential simultaneous bidirectional interface; symmetric multi-processor systems; Bandwidth; Clocks; Communication cables; Crosstalk; Design optimization; Integrated circuit interconnections; Jitter; Power system interconnection; Timing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
  • Conference_Location
    Monterey, CA, USA
  • Print_ISBN
    0-7803-7451-7
  • Type

    conf

  • DOI
    10.1109/EPEP.2002.1057871
  • Filename
    1057871