Title :
Electrical modeling of high-speed source synchronous communication
Author :
Rubin, B.J. ; de Araujo, D.N. ; Pham, N. ; Cases, M.
Author_Institution :
IBM Res. Div., T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The basic electrical package modeling issues for source synchronous communication are discussed, and modeling techniques are reviewed. A new fine-grained approach that include all essential package features are discussed, with emphasis on coupled and delta-I noises and the interactions between the clock and the signal bus waveforms.
Keywords :
circuit noise; circuit simulation; clocks; digital communication; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; integrated memory circuits; memory architecture; clock/signal bus waveform interactions; coupled noise; delta-I noise; electrical package modeling; fine-grained approach; high-speed source synchronous communication; memory architecture; modeling techniques; package features; Centralized control; Clocks; Crosstalk; Drives; Electronics packaging; Frequency; Jitter; Microprocessors; Power distribution; Signal design;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057875
