Title :
Quality determination of microwelding connections of integral schemes
Author :
Tsyganok, B. ; Friedel, J.
Author_Institution :
Dept. of Electron., Nat. Tech. Univ. of Ukraine, Kiev, Ukraine
Abstract :
In this paper are given some results of analysis of microwelded connections by photoacoustic microscopy. This method can be used for gradiated appreciation of quality control of connections in electronics.
Keywords :
acoustic microscopy; microassembling; photoacoustic effect; quality control; ultrasonic welding; electronic connection; gradiated appreciation; integral schemes; microwelding connections; photoacoustic microscopy; quality control; quality determination; Adhesives; Aluminum; Electron microscopy; Frequency modulation; Optical materials; Photoacoustic effects; Quality control; Silicon; Testing; Welding;
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
DOI :
10.1109/ISSE.2003.1260553
