Title :
The small scale systems integration and packaging center - a New York State Center of Excellence [Advertisement]
fDate :
May 30 2012-June 1 2012
Abstract :
The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP) enables new electronics applications and devices to improve the way people live and interact with their surroundings.
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA, USA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231403
