Title :
Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method
Author :
Morsey, Jason ; Okhmatovski, Vladimir ; Cangellaris, Andreas C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
Modeling methodologies are proposed for lossy conductors of finite thickness. The proposed models are such that neither the ease of implementation nor the computational efficiency of a fast adaptive integral equation method-based electromagnetic field solver is penalized.
Keywords :
circuit analysis computing; computational complexity; electromagnetic field theory; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; adaptive integral equation method-based electromagnetic field solver; computational efficiency; finite thickness lossy conductors; finite-thickness conductor models; full-wave interconnect analysis; modeling methodologies; Computational efficiency; Conductivity; Conductors; Crosstalk; Electromagnetic analysis; Electromagnetic fields; Electromagnetic modeling; Integral equations; Packaging; Surface impedance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057880
