Title :
High-Q inductors in a MAPBGA package substrate
Author :
Tsai, Chi-Taou ; Andrews, James
Author_Institution :
Semicond. Product Sector, Motorola Inc., Tempe, AZ, USA
Abstract :
A packaged-level inductor structure is reported to be an alternative approach to chip-level high Q inductors. Its potential performance was demonstrated by experimental characterization of a test vehicle implemented in a MAPBGA package.
Keywords :
ball grid arrays; inductors; moulding; plastic packaging; MAPBGA package substrate; high-Q inductors; molded array plastic ball grid array; package substrate; packaged-level inductor structure; test vehicle; Active inductors; Bonding; CMOS technology; Circuits; Costs; Electronics packaging; Spirals; Substrates; Voltage-controlled oscillators; Wires;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057883
