• DocumentCode
    2505553
  • Title

    High-Q inductors in a MAPBGA package substrate

  • Author

    Tsai, Chi-Taou ; Andrews, James

  • Author_Institution
    Semicond. Product Sector, Motorola Inc., Tempe, AZ, USA
  • fYear
    2002
  • fDate
    21-23 Oct. 2002
  • Firstpage
    59
  • Lastpage
    62
  • Abstract
    A packaged-level inductor structure is reported to be an alternative approach to chip-level high Q inductors. Its potential performance was demonstrated by experimental characterization of a test vehicle implemented in a MAPBGA package.
  • Keywords
    ball grid arrays; inductors; moulding; plastic packaging; MAPBGA package substrate; high-Q inductors; molded array plastic ball grid array; package substrate; packaged-level inductor structure; test vehicle; Active inductors; Bonding; CMOS technology; Circuits; Costs; Electronics packaging; Spirals; Substrates; Voltage-controlled oscillators; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
  • Conference_Location
    Monterey, CA, USA
  • Print_ISBN
    0-7803-7451-7
  • Type

    conf

  • DOI
    10.1109/EPEP.2002.1057883
  • Filename
    1057883
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2505553