• DocumentCode
    2505604
  • Title

    Evaluation of a vortex model of buoyancy-driven recirculation in potential flow analysis of data center performance

  • Author

    Toulouse, Michael M. ; Lettieri, David J. ; Carey, Van P. ; Bash, Cullen E. ; Shah, Amip J.

  • Author_Institution
    Mech. Eng. Dept., Univ. of California, Berkeley, CA, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    51
  • Lastpage
    59
  • Abstract
    The prediction of flow and temperature in data center operation is of particular importance in creating better capacity utilization and lower capital costs. However, it is often a time- and computing-intensive task, and would be well served by more expeditious modeling methods than full Computational Fluid Dynamic (CFD) thermofluidic models. A software package named COMPACT (Compact Model of Potential Flow and Convective Transport) was developed to provide one such alternative. Recent versions of COMPACT take under 10 seconds on a commercially available laptop to characterize a 550 square foot data center; the same room modeled with a CFD solver took 8 hours. Having the ability to create velocity and temperature predictions orders of magnitude faster than conventional CFD allow a variety of data center applications for the model, such as use as a first-order design tool, a potential improvement to plant-based controllers, a tool for system-wide assessment of life-cycle efficiency, and as an initial guess for complex CFD solvers. COMPACT applies convective energy transport equations to a computed potential flow field to approximate a flow and temperature field. The results from this model were compared to experimental measurements taken from a data center at Hewlett-Packard Laboratories in Palo Alto, CA. The presence of high localized temperatures in the model led to the conclusion that recirculation and buoyancy were contributing excessively to error in the model. A novel approach was proposed to account for these effects: a non-iterative (to preserve computational resources) method of vortex superposition, in which hot locations in the original model are analyzed and a corrective flow field consisting of Rankine vortices is superimposed on the solution. An updated model using this approach was tested with further experimental measurements taken from the data center at HP Labs, and identical inputs were used to compare COMPACT to commercially available CFD. These n- wer results showed a marked decrease in mean deviation of the model from measured temperatures, as well as elimination of the highly localized temperatures which afflicted the original COMPACT results. The vortex superposition model was also “tuned”, with vortex strength optimized for multiple test cases at varying levels of recirculation. In addition, the model-generated velocity and temperature fields were used to locate and quantify the destruction of exergy resulting from the mixing of warmer and cooler air in the room; these results are used as a measure of system efficiency.
  • Keywords
    computer centres; convection; mechanical engineering computing; remaining life assessment; vortices; CFD thermofluidic models; COMPACT software package; Hewlett-Packard laboratory; Rankine vortices; buoyancy-driven recirculation; compact model of potential flow and convective transport; computational fluid dynamic; convective energy transport equations; data center performance; first-order design tool; flow prediction; life-cycle efficiency assessment; model-generated velocity; plant-based controllers; potential flow analysis; system-wide assessment; temperature predictions; time 10 s; time 8 hour; vortex model evaluation; vortex strength; vortex superposition model; Atmospheric modeling; Computational fluid dynamics; Computational modeling; Data models; Mathematical model; Servers; Temperature measurement; CFD; compact; convective transport; exergy destruction; expeditious; life cycle exergy assessment; modeling; server room; thermal performance; vortex superposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231413
  • Filename
    6231413