Hostaflon TFM “second generation” fluoropolymer for improved contamination control

Author

Schlipf, Michael ; Lohr, Gernot ; Hintzer, Klaus ; Abate, Jim ; Spell, Rob

Author_Institution

Dyneon, Germany

fYear

1996

fDate

14-16 Oct 1996

Firstpage

218

Lastpage

222

Abstract

Polytetrafluoroethylene (PTFE) and per-fluorinated fluorothermoplastics such as PFA, a copolymer of tetrafluoroethylene with some 4 wt% perfluoroalkylvinylether, have become materials of choice in semiconductor manufacturing machinery for critical chemical and gas interface components. Hostaflon TFM, the 2nd generation PTFE, complements PFA in semiconductor applications in a way that cannot be achieved by non-modified PTFE. This paper identifies the benefits in contamination control and reliability of Hostaflon TFM components used in the semiconductor manufacturing industry

Keywords

polymers; semiconductor technology; surface contamination; Hostaflon TFM; PFA; PTFE; chemical component; contamination control; gas interface component; perfluorinated fluorothermoplastic; polytetrafluoroethylene; second generation fluoropolymer; semiconductor manufacturing; tetrafluoroethylene perfluoroalkylvinylether copolymer; Bonding; Bones; Chemicals; Machinery; Polarization; Polymers; Semiconductor device manufacture; Semiconductor materials; Surface contamination; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559734

Filename

559734