DocumentCode
2505697
Title
Finite ground plane packaging effects on a dual-band PIFA
Author
Herting, Brian J. ; Perrotta, Alessandro ; Bernhard, Jennifer T.
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fYear
2002
fDate
21-23 Oct. 2002
Firstpage
95
Lastpage
98
Abstract
A dual-band planar inverted-F antenna (PIFA) is proposed and the effects of packaging, i.e. the ground plane, on its operation are studied. A subsequent method for choosing the optimal ground plane dimensions is presented.
Keywords
antenna theory; microstrip antennas; mobile antennas; multifrequency antennas; packaging; dual-band PIFA; dual-band planar inverted-F antenna; finite ground plane packaging effects; integrated low profile multi-band antenna; mobile connectivity; optimal ground plane dimensions; probe fed microstrip patch antenna; Bandwidth; Dual band; Electronics packaging; Feeds; Impedance; Integrated circuit interconnections; Microstrip antennas; Parametric study; Receiving antennas; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-7451-7
Type
conf
DOI
10.1109/EPEP.2002.1057891
Filename
1057891
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