Title :
Finite ground plane packaging effects on a dual-band PIFA
Author :
Herting, Brian J. ; Perrotta, Alessandro ; Bernhard, Jennifer T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
A dual-band planar inverted-F antenna (PIFA) is proposed and the effects of packaging, i.e. the ground plane, on its operation are studied. A subsequent method for choosing the optimal ground plane dimensions is presented.
Keywords :
antenna theory; microstrip antennas; mobile antennas; multifrequency antennas; packaging; dual-band PIFA; dual-band planar inverted-F antenna; finite ground plane packaging effects; integrated low profile multi-band antenna; mobile connectivity; optimal ground plane dimensions; probe fed microstrip patch antenna; Bandwidth; Dual band; Electronics packaging; Feeds; Impedance; Integrated circuit interconnections; Microstrip antennas; Parametric study; Receiving antennas; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057891
