Chip package co-design of the RF front end with an integrated antenna on multilayered organic material

To better understand the impact of noise on an RF front end, a sensitivity analysis must be performed in both the frequency and time domains for each element and for the system. This paper illustrates the design and sensitivity analysis of a microstrip patch antenna and an embedded passive matching circuit on multi-layered organic (MLO) material. To study the chip package co-design issues, the effect of a transient on the antenna´s input and radiation characteristics and on the matching circuit have been evaluated using a sinusoid of 5 cycles applied to circuitry in close proximity to these. It is shown that the coupling to the antenna affects the radiation characteristics significantly. By placing sections of grounded transmission lines it has been demonstrated that the effect of the transient can be detuned.