Computing self and mutual capacitance and inductance using even and odd TDR measurements

Author

Smolyansky, Dima A. ; Corey, Steven D.

Author_Institution

TDA Systems, Inc., Portland, OR, USA

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

117

Lastpage

122

Abstract

TDR (time domain reflectometry) measurement techniques for IC package characterization have been reported extensively and standardized by JEDEC, (Publication #123, JC-15 Committee, 1995). In addition, several techniques utilizing differential TDR measurements have been reported in (D.A. Smolyansky, High Density Interconnect Magazine, 2001). In this paper, we present a novel technique for computing self and mutual inductance and capacitance. This technique is based on applying computational procedures as described in the JEDEC publication to even and odd mode TDR measurements of the device under test, such as connector or IC package.

Keywords

capacitance; capacitance measurement; circuit analysis computing; electric connectors; electric impedance; inductance; inductance measurement; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; measurement standards; time-domain reflectometry; IC interconnects; IC package characterization; IC package self/mutual capacitance/inductance computation; JEDEC standards; common mode TDR measurements; connectors; differential time domain reflectometry measurements; even/odd mode TDR measurements; self impedance; Automatic testing; Capacitance measurement; Connectors; Equations; Impedance measurement; Inductance measurement; Integrated circuit packaging; Integrated circuit testing; Measurement techniques; Pins;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057896

Filename

1057896