Validation of frequency-dependent, lossy transmission line simulations for printed circuit boards

Author

Heckmann, David L. ; Timpane, Trevor J.

Author_Institution

Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

149

Lastpage

152

Abstract

Accurate interconnect modeling is crucial for signal integrity analysis. Simulation of frequency-dependent transmission lines plays a key role in any interconnect simulations. This paper presents simulation results from three separate transmission line circuit simulation algorithms. The results are compared with laboratory measurements for validation. Two of the three methods investigated show excellent agreement with laboratory measurements.

Keywords

SPICE; circuit simulation; interconnections; printed circuit testing; printed circuits; transmission line theory; HSPICE; PowerSPICE; frequency-dependent lossy transmission line simulations; interconnect modeling; laboratory measurements; model validation; printed circuit boards; signal integrity analysis; transmission line circuit simulation algorithms; Circuit simulation; Circuit testing; Computational modeling; Distributed parameter circuits; Frequency dependence; Integrated circuit interconnections; Laboratories; Power transmission lines; Printed circuits; Propagation losses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057903

Filename

1057903