DocumentCode :
2505946
Title :
Impact of heatsink attach loading on FCBGA package thermal performance
Author :
Kanuparthi, Sasanka L. ; Galloway, Jesse E. ; McCain, Scott
Author_Institution :
Amkor Technol., Chandler, AZ, USA
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
216
Lastpage :
223
Abstract :
Flip-Chip Ball Grid Array (FCBGA) packages are prevalent in wide range of electronics applications including gaming consoles, mobile gadgets, telecommunications etc. The microelectronics industry is actively shifting towards smaller node sizes (32 nm, 28 nm etc.) and integrating multiple functionalities onto the die. This in turn increases the die power levels and more importantly drastically increases the die heat-flux densities. External heatsinks are typically needed in order to support high thermal power dissipation. The focus of this paper is to understand and quantify the impact of heatsink tilt on board-level thermal performance. her This in turn impacts the overall thermal performance as higher TIM-II bond line thickness results in greater thermal resistance. For high power applications (>;50W) wherein the desired system thermal resistances are very low (θja <; 1 C/W), controlling the TIM-II thermal resistance is critical to achieve an overall low system thermal resistance. Experimental measurements were performed using a high power FCBGA thermal test vehicle (TTV). The scope of this study includes performing thermal measurements to -level thermal understand the impact of the following on board performance: 1. Package type: Bare Die FCBGA, Molded FCBGA & Lidded FCBGA 2. Impact of uneven heat-sink loading A novel method for characterizing TIM-II thickness variation is presented in this work. Upon characterizing the TIM-II BLT thickness variation, experimental measurements were performed to quantify the impact on the board-level thermal performance. Finally, merit analysis of the various package types in achieving low overall package thermal resistance will be presented.
Keywords :
ball grid arrays; flip-chip devices; heat sinks; integrated circuit packaging; thermal resistance; FCBGA package; TTV; board-level thermal performance; electronics applications; flip-chip ball grid array; heat sink attach loading; microelectronics industry; thermal resistance; thermal test vehicle; Electronic packaging thermal management; Heating; Loading; Pins; Springs; Thermal resistance; FCBGA; lidded FCBGA; molded FCBGA; thermal interface materials; warpage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231433
Filename :
6231433
Link To Document :
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