The cleaning importance in microelectronics technology

The paper discusses cleaning as a necessary technological step in electronic and electric assembly processes today, including SMT. Increased miniaturization, higher speeds and tighter board space highlights that need, as well as request for higher, reliability by some type of applications (automotive, medical etc.). In more with introduction of ISO 14000 the cleaning becomes to be more and more important for different parts of technological processes, including lead-free solders. There are some technologies, like vapor cleaning, which needs very complicated and expensive machines to follow ecology requirements, thus they are used only for special applications. Lot of companies, mostly the small ones that are using one of previous methods has request for a cheap, effective equipment with low operating costs that suits to their needs as much as possible. An example of such system, built up for MPC (micro phase cleaning) technology or semi aqueous technology is introduced in a second part of this paper. It consists of several modules, where each module is in fact independent machine specially designed for one process. Modules now available are for spraying, rinsing, ultrasonic rinsing, active immersing and drying. So customers can take their own decision for a single one or to make a more complex line. Modules are manually operated with automatic processing control when higher production throughput is required an automatic transfer system can be added. Cleaning media in modules form closed-loop regeneration system to minimize waste, to reduce cleaning cost and to keep safe and environmental friendly process.