DocumentCode
2506004
Title
In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configuration
Author
Kodama, Takashi ; Park, Woosung ; Marconnet, Amy ; Lee, Jaehoo ; Asheghi, Mehdi ; Goodson, Kenneth E.
Author_Institution
Dept. of Mech. Eng., Stanford Univ., Escondido, CA, USA
fYear
2012
fDate
May 30 2012-June 1 2012
Firstpage
250
Lastpage
255
Abstract
In this study, we measure the in-plane thermal conductivity of palladium (Pd) nanowire with varying length (3-50 μm) and width (100-250 nm). The bridges are fabricated by electron beam lithography with an on-substrate measurement configuration. The measurements are performed on substrates with 190 nm and 2.9 μm thick thermal oxide using a 4-probe steady-state DC Joule heating method, and several suspended structure are also prepared to investigate the accuracy of the on-substrate results. For the on-substrate measurements, the thermal conductivity is estimated for short nanowires assuming the magnitude of the heat loss to the substrate from measurements of longer nanowires. As a result, the measured thermal conductivity is 30 ± 5 W/mK for suspended short nanowires at room temperature, and the estimated thermal conductivity for the on-substrate samples are consistent with this value. The measurements on the substrate with 2.9 μm oxide result in small variations between samples (± 5 W/mK), while the results on 190 nm thick oxide has a larger variation and uncertainty (>; ± 20 W/mK) due to the uncertainty in the magnitude of the heat loss to the substrate. Sufficient measurement accuracy is only achieved if the heat loss to the substrate can be estimated or measured with high accuracy.
Keywords
electron beam lithography; heat losses; nanowires; thermal conductivity measurement; electron beam lithography; heat loss; in-plane thermal conductivity measurement; nanoscale conductive materials; nanowire; on-substrate device configuration; steady-state DC Joule heating method; Conductivity; Conductivity measurement; Heating; Resistance; Substrates; Temperature measurement; Thermal conductivity; Joule heating measurement; Nanowire; electron beam lithography; in-plain thermal conductivity; nanofabrication; nanolithography;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
978-1-4244-9533-7
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2012.6231437
Filename
6231437
Link To Document