Ultra-reliable packaging for silicon-on-silicon WSI

The advantages of using silicon instead of conventional ceramic as the substrate material in silicon-on-silicon wafer-scale integration (WSI) packaging are discussed, and the status of this technology at other organizations, as reflected in the literature, is reviewed. It is argued that there exists an untapped potential for significant reliability improvements by switching to packages specifically designed for silicon substrates. Several packaging approaches are reviewed, and results are presented for the fatigue life and thermal performance of silicon substrates