The optimal value selection of decoupling capacitors based on FDFD combined with optimization

Author

Yang, Xiaoping ; Chen, Qing-lun ; Chen, Chi-te

Author_Institution

INTEL Corp., Shanghai, China

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

191

Lastpage

194

Abstract

This paper describes a novel decoupling capacitor attachment method, which can promptly guide engineers to select the optimal value of decoupling capacitors to suppress low, middle and high frequency noise for board/package/system design. Analysis of a 6 layer PCB indicated the methodology could efficiently and automatically guide engineers to attach suitable valued decoupling capacitors to boards, packages and chips.

Keywords

capacitors; circuit noise; circuit optimisation; finite difference methods; integrated circuit design; interference suppression; printed circuit design; IC design; PCB design; board/package/system design; circuit optimization; decoupling capacitor attachment methods; decoupling capacitor optimal value selection; finite-difference frequency domain methods; low/middle/high frequency noise suppression; multilayer PCB; Capacitors; Design engineering; Frequency domain analysis; Joining processes; Low-frequency noise; Packaging; Power engineering and energy; Power system modeling; Resonant frequency; Working environment noise;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057913

Filename

1057913