Title :
A methodology for optimizing the selection of decoupling components for power delivery systems of high-performance ASICs
Author :
Beker, Benjamin ; Wallace, Doug
Author_Institution :
Adv. Micro Devices Inc., Austin, TX, USA
Abstract :
This paper describes an approach for optimizing the selection of de-coupling components for the power delivery network of a high-performance ASIC package. The proposed approach is aimed at reducing the guess-work that is typically associated with the design of an appropriate de-coupling scheme, which meets desired performance targets. It is partly based on constructing a distributed circuit model of the entire power delivery system (package and board) with sufficient spatial (and frequency) resolution, supplemented by exploiting the simple concepts of resonant circuit characteristics over a desired frequency band. The application of the methodology is illustrated for a high-end ASIC package, which has limited package-level and board-level resources.
Keywords :
RLC circuits; application specific integrated circuits; capacitors; circuit noise; circuit optimisation; circuit resonance; circuit simulation; integrated circuit design; integrated circuit modelling; integrated circuit packaging; power supply circuits; printed circuit design; transient response; ASIC decoupling component selection optimization; decoupling capacitors; decoupling schemes; high-end ASIC package-level/board-level resources; high-performance ASIC power delivery systems; model spatial/frequency resolution; package/board distributed circuit models; parallel resonant circuit RCL parameters; power delivery networks; power supply noise; resonant circuit frequency band; transient response; Application specific integrated circuits; Capacitors; Frequency; Impedance; Microprocessors; Optimization methods; Packaging; Power supplies; Power system modeling; RLC circuits;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057914
