DocumentCode :
2506187
Title :
The thermal behavior of a flip-chip laser array within a Photonics Integrated Circuit (PIC)
Author :
Connor, John O. ; Punch, Jeff
Author_Institution :
Stokes Inst., Univ. of Limerick, Limerick, Ireland
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
325
Lastpage :
332
Abstract :
For telecommunications applications, Photonics Integrated Circuits (PICs) are currently under development in order to realize devices such as optical transmitters and receivers. PICs offer compelling advantages in terms of performance, miniaturization and - in some applications - energy efficiency. High-density PICs represent a significant thermal management challenge, however, particularly for laser arrays. These devices feature tight temperature limits (±0.1K), low operating temperatures (as low as 15-25°C), moderate heat loads (~1-10W) but very high heat fluxes (over 100Wcm-2). Contemporary hybrid packaging strategies involve low profile (<;1mm) multilayer substrates interposed between the devices (~3×3mm) and thermo-electric modules (TEM) (~30×30mm) which provide thermo-mechanical compatibility (with semiconductor materials), high thermal conductivity and electrical interconnection. These substrates are typically Aluminum Nitride (AlN) or silicon with metalized layers and plated vias. The theme of this paper is the interconnection details of a `flip-chipped´ laser array PIC to ensure adequate heat transfer into its carrier substrate. The objective is to understand the influence of three parameters; laser-to-laser spacing within the array, characteristics of the metallization geometries, and the location of heat generating passive devices adjacent to the PIC. Using finite element analysis (FEA), a set of coupled numerical models was created to capture the thermal behavior of a representative laser array within a flip-chip PIC. It was found that laser-to-laser spacing has a strong effect on the temperature distributions across the array; also the influence of adjacent passive devices has no significant bearing on the laser array temperature. This paper represents the initial results of an extensive programme of work on packaging-related aspects of next-generation PICs.
Keywords :
electronics packaging; flip-chip devices; heat transfer; integrated circuit interconnections; integrated optics; laser arrays; laser beam applications; metallisation; carrier substrate; finite element analysis; flip-chip laser array; flip-chipped laser array PIC; heat generating passive device; heat transfer; laser array temperature; laser-to-laser spacing; metallization geometry; packaging-related aspect; photonics integrated circuit; temperature distribution; thermal property; Arrays; Heating; Laser modes; Metallization; Substrates; Thermal resistance; Flip-chip; Heat Spreading; Laser Arrays; Metallization; Photonic Integrated Circuits; Thermal Control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231447
Filename :
6231447
Link To Document :
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