• DocumentCode
    2506200
  • Title

    Scalable manufacturing of hierarchical nanostructures for thermal management

  • Author

    Love, Christopher J. ; Smith, J. David ; Cui, Yuehua ; Kwon, HyukMin ; Varanasi, Kripa K.

  • Author_Institution
    Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    333
  • Lastpage
    337
  • Abstract
    Thermal oxidation of copper is a simple and scalable method to produce copper oxide nanowires. We report for the first time the formation of nanowires on copper powder during thermal oxidation and the resulting nanowire coverage that is dependent on initial particle size. Systematic thermogravimetric analysis (TGA) and in-situ x-ray diffraction (XRD) studies of thermal oxidation of particles of different sizes provide insights into the size-dependent process and evolution of the various phases of copper and copper oxide with time. Furthermore, we find that a large void is formed within these particles after oxidation and propose a mechanism based on the Kirkendall effect. Using this new size-dependent oxidation process, we demonstrate the simple and scalable creation of new hierarchical structures for applications in thermal management, including electronics cooling and boiling.
  • Keywords
    X-ray diffraction; chemical interdiffusion; copper; copper compounds; nanowires; oxidation; particle size; thermal analysis; thermal management (packaging); voids (solid); Cu; CuO; Kirkendall effect; copper oxide; copper powder; electronics boiling; electronics cooling; hierarchical nanostructure; hierarchical structure; in-situ X-ray diffraction; nanowire; particle size; size-dependent oxidation process; size-dependent process; thermal management; thermal oxidation; thermogravimetric analysis; void; Copper; Heat transfer; Heating; Nanowires; Oxidation; Powders; X-ray scattering; boiling; copper oxide; heat pipe; hollow particles; nanowires; oxidation; spray cooling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231448
  • Filename
    6231448