DocumentCode :
2506437
Title :
A velocity averaging method for bridging molecular dynamics with finite element analysis
Author :
Lee, Yongchang ; Basaran, Cemal
Author_Institution :
Dept. of Civil, Struct., & Environ. Eng., State Univ. of New York at Buffalo, Buffalo, NY, USA
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
399
Lastpage :
402
Abstract :
In computational mechanics, molecular dynamics (MD) and finite element (FE) analysis are well developed and most popular on microscale and macroscale analysis, respectively. MD can very well simulate the atomistic behavior, but cannot simulate macroscale length and time due to computational limits. FE can very well simulate continuum mechanics (CM) problems, but has the limitation on the atomistic level degree of freedom. Multiscale modeling is an expedient methodology with a potential to connect different levels of modeling such as quantum mechanics, molecular dynamics, and continuum mechanics. Developing nanotechnologies require a new simulation method which has both advantages of MD and FE. This paper proposes a new multiscale modeling technique to couple MD with FE. The proposed method relies on combining velocities principle. 1D wave propagation example has been used to illustrate the challenges in coupling MD with FE and to verify the proposed velocity combination approach.
Keywords :
continuum mechanics; finite element analysis; molecular dynamics method; nanotechnology; 1D wave propagation; CM problems; FE analysis; FE, macroscale analysis; atomistic behavior; atomistic level degree of freedom; computational mechanics; continuum mechanic problems; expedient methodology; finite element analysis; macroscale length simulation; molecular dynamics; multiscale modeling technique; nanotechnology; quantum mechanics; velocity averaging method; velocity combination approach; Computational modeling; Couplings; Iron; Kinetic energy; Mathematical model; Reflection; a multiscale method; continuum mechanics; molecular dynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231457
Filename :
6231457
Link To Document :
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