DocumentCode
2506465
Title
Depth profiling of chemical bonding states of impurity atoms and their correlation with electrical activity in Si shallow junctions
Author
Tsutsui, Kazuo ; Hoshino, Norifumi ; Nakagawa, Yasumasa ; Tanaka, Masaoki ; Nohira, Hiroshi ; Kakushima, Kuniyuki ; Ahemt, Parhat ; Sasaki, Yuichiro ; Mizuno, Bunji ; Hattori, Takeo ; Iwai, Hiroshi
Author_Institution
Interdiscipl. Grad. Sch. of Sci. & Eng., Tokyo Inst. of Technol., Yokohama, Japan
fYear
2010
fDate
10-11 May 2010
Firstpage
1
Lastpage
4
Abstract
Chemical bonding states of doped impurities such as B, As, P and Sb in Si were analyzed by soft X-ray photoelectron spectroscopy (SXPES). A step-by-step shallow etching and Hall effect measurements were combined with the SXPES to investigate correlation between chemical bonding state and electrical activation, and to clarify depth profiles of concentration of activated and deactivated impurities in shallow junctions. The study of B doped layer revealed that one chemical bonding state is assined to activated B and the other two states are correlated with deactivated B, which probably form B clusters. On the other hand, two different chemical bonding states were detected for each donor type impurity (As, P and Sb), however, these two states could not be necessarily correlated with the electrically activated and deactivated atoms.
Keywords
Hall effect; X-ray photoelectron spectra; bonds (chemical); doping profiles; etching; semiconductor junctions; silicon; As; B; Hall effect measurements; P; SXPES; Sb; chemical bonding states; deactivated atoms; deactivated impurity; depth profiles; depth profiling; doped impurity; electrical activation; electrical activity; electrically activated atoms; impurity atoms; shallow etching; shallow junctions; soft X-ray photoelectron spectroscopy; Annealing; Atomic measurements; Bonding; Chemical analysis; Chemical technology; Crystallization; Etching; Hall effect; Impurities; Spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2010 International Workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5866-0
Type
conf
DOI
10.1109/IWJT.2010.5474909
Filename
5474909
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