• DocumentCode
    2506465
  • Title

    Depth profiling of chemical bonding states of impurity atoms and their correlation with electrical activity in Si shallow junctions

  • Author

    Tsutsui, Kazuo ; Hoshino, Norifumi ; Nakagawa, Yasumasa ; Tanaka, Masaoki ; Nohira, Hiroshi ; Kakushima, Kuniyuki ; Ahemt, Parhat ; Sasaki, Yuichiro ; Mizuno, Bunji ; Hattori, Takeo ; Iwai, Hiroshi

  • Author_Institution
    Interdiscipl. Grad. Sch. of Sci. & Eng., Tokyo Inst. of Technol., Yokohama, Japan
  • fYear
    2010
  • fDate
    10-11 May 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Chemical bonding states of doped impurities such as B, As, P and Sb in Si were analyzed by soft X-ray photoelectron spectroscopy (SXPES). A step-by-step shallow etching and Hall effect measurements were combined with the SXPES to investigate correlation between chemical bonding state and electrical activation, and to clarify depth profiles of concentration of activated and deactivated impurities in shallow junctions. The study of B doped layer revealed that one chemical bonding state is assined to activated B and the other two states are correlated with deactivated B, which probably form B clusters. On the other hand, two different chemical bonding states were detected for each donor type impurity (As, P and Sb), however, these two states could not be necessarily correlated with the electrically activated and deactivated atoms.
  • Keywords
    Hall effect; X-ray photoelectron spectra; bonds (chemical); doping profiles; etching; semiconductor junctions; silicon; As; B; Hall effect measurements; P; SXPES; Sb; chemical bonding states; deactivated atoms; deactivated impurity; depth profiles; depth profiling; doped impurity; electrical activation; electrical activity; electrically activated atoms; impurity atoms; shallow etching; shallow junctions; soft X-ray photoelectron spectroscopy; Annealing; Atomic measurements; Bonding; Chemical analysis; Chemical technology; Crystallization; Etching; Hall effect; Impurities; Spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2010 International Workshop on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5866-0
  • Type

    conf

  • DOI
    10.1109/IWJT.2010.5474909
  • Filename
    5474909