Title :
Vacancy-type defects in ultra-shallow junctions fabricated using plasma doping studied by positron annihilation
Author :
Uedono, Akira ; Tsutsui, Kazuo ; Ishibashi, Shoji ; Watanabe, Hiromichi ; Kubota, Shoji ; Tenjinbayashi, Kazuki ; Nakagawa, Yasumasa ; Mizuno, Bunji ; Hattori, Takeo ; Iwai, Hiroshi
Author_Institution :
Inst. of Appl. Phys., Univ. of Tsukuba, Tsukuba, Japan
Abstract :
Vacancy-type defects in plasma immersion B-implanted Si were probed by a monoenergetic positron beam. A positron annihilates with an electron and emits two 511 keV γ-quanta. Doppler broadening spectra of the annihilation radiation were measured and compared with spectra calculated using the first-principles calculations. For the as-doped sample, the vacancy-rich region was found to be localized within 0-10 nm from the surface, and the major defect species were determined to be divacancy-B complexes. After spike rapid thermal annealing at 1075°C, those complexes were annealed out, and turned to B clusters such as icosahedral B12 distributed between 4 nm and 32 nm from the surface. We will demonstrate that that the positron annihilation technique is sensitive to point defects in shallow junctions formed on Si substrates without influence of B atoms located in the substitutional site.
Keywords :
Doppler broadening; ab initio calculations; boron; elemental semiconductors; impurity absorption spectra; plasma immersion ion implantation; positron annihilation; rapid thermal annealing; semiconductor doping; silicon; substrates; vacancies (crystal); Doppler broadening spectra; Si; Si:B; divacancy-B complexes; first-principles calculations; icosahedral B12; monoenergetic positron beam; plasma doping; plasma immersion boron-implanted silicon; point defects; positron annihilation; rapid thermal annealing; temperature 1075 C; ultrashallow junctions; vacancy-type defects; Doping; Electron emission; Electron traps; Plasma accelerators; Plasma applications; Plasma immersion ion implantation; Plasma measurements; Plasma properties; Positrons; Rapid thermal annealing;
Conference_Titel :
Junction Technology (IWJT), 2010 International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5866-0
DOI :
10.1109/IWJT.2010.5474912