DocumentCode
2506634
Title
Non-destructive S-parameter measurement of a hermetically encapsulated package with comparison to high-frequency simulation
Author
Pfeiffer, Ullrich ; Schuster, Christian
fYear
2002
fDate
21-23 Oct. 2002
Firstpage
323
Lastpage
326
Abstract
A novel methodology is presented for non-destructive S-parameter measurement of hermetically encapsulated packages using an on-chip programmable termination network and a port reduction method. Measured results for a QFN package are compared to simulations.
Keywords
S-parameters; circuit simulation; crosstalk; encapsulation; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; IC electromagnetic package effects; QFN packages; crosstalk; hermetical sealing; hermetically encapsulated packaging; nondestructive S-parameter measurement; on-chip programmable termination networks; package HF simulation; package characterization; port reduction methods; Bonding; Electric variables measurement; Electronics packaging; Grounding; Hermetic seals; Scattering parameters; Semiconductor device measurement; Semiconductor device packaging; Testing; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-7451-7
Type
conf
DOI
10.1109/EPEP.2002.1057942
Filename
1057942
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