Title :
Thermal management of a high-performance multichip module
Author :
Chen, C.C. ; Young, P.L. ; Cech, J.M.
Author_Institution :
Boeing Electron. Co., Seattle, WA, USA
Abstract :
Experimental and analytical studies on the thermal characteristics of an advanced multichip module for high-speed circuits are presented. A thermal test module was built and tested in a low-speed wind tunnel with air velocity from 4 to 12 m/s. The analysis was carried out with a three-dimensional finite-difference thermal modeling program. The results shows that the module with an internal thermal resistance of 0.68 C/W, on a per chip basis, has high power-handling capabilities. A junction-to-ambient resistance of about 2.0 C/W is achievable with a heat sink in a practical forced-air-cooling environment.<>
Keywords :
cooling; heat sinks; hybrid integrated circuits; packaging; advanced multichip module; air velocity; forced-air-cooling environment; heat sink; high-performance multichip module; high-speed circuits; internal thermal resistance; junction-to-ambient resistance; low-speed wind tunnel; power-handling capabilities; thermal characteristics; thermal management; thermal test module; three-dimensional finite-difference thermal modeling program; Circuit testing; Copper; Heat sinks; Integrated circuit interconnections; Multichip modules; Packaging; Silicon; Substrates; Thermal management; Thermal resistance;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12608
