DocumentCode
2506954
Title
Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias
Author
Ziabari, Amirkoushyar ; Shakouri, Ali
Author_Institution
Univ. of California Santa Cruz (UCSC), Santa Cruz, CA, USA
fYear
2012
fDate
May 30 2012-June 1 2012
Firstpage
588
Lastpage
596
Abstract
A fast convolution-based technique, deemed Power Blurring, is demonstrated for thermal analysis of 3D ICs, including thermal vias. The temperature resulting from any power may in each layer of the chip can be computed without the need to re-mesh the whole structure. The maximum error in estimation time is reduced by a factor of 76× compared to finite element software.
Keywords
thermal analysis; three-dimensional integrated circuits; 3D IC; convolution-based technique; estimation time; finite element software; power blurring; thermal analysis; thermal simulation; thermal vias; vertically integrated circuits; Abstracts; Facsimile; Finite element methods; Heating; Integrated circuits; Silicon; Thermal analysis; 3D IC; Fast Thermal Simulation; Power Blurring Method; Thermal Via;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
978-1-4244-9533-7
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2012.6231482
Filename
6231482
Link To Document