Title :
Contributionxc of carbon to growth of strained silicon, dopant activation and diffusion in silicon
Author :
Itokawa, Hiroshi
Author_Institution :
Adv. Unit Process Technol. Dept., Toshiba Corp., Yokohama, Japan
Abstract :
C incorporation into Si and SiGe has become essential in modern high-performance CMOSFET technology. The reason is that C atom is markedly useful in growing strained Si film and controlling diffusion of dopant atoms in Si and SiGe layers. In this paper, contribution of C atoms to the growth of strained Si and SiGe films, the activation and the diffusion of B in Si are described. Interstitial C atoms inhibit an epitaxial growth of strained Si:C and SiGe films in both case for the C implantation followed by annealing and for the epitaxial growth of SiGe:C by RP-CVD. Suppressions of the localized change in strain caused by C incorporation and the localized C atoms successfully achieve a high-crystallinity strained Si:C and SiGe:C films with a high substitutional concentration. A B activation ratio in Si varies depending on incorporated C concentration in the wide range of C and B concentration. Furthermore, C atoms enhance the growth of stable B-containing clusters at a high B concentration region in Si, resulting in decrease in the B activation ratio in Si layer.
Keywords :
Ge-Si alloys; annealing; carbon; chemical interdiffusion; chemical vapour deposition; doping profiles; elemental semiconductors; impurity states; internal stresses; interstitials; semiconductor doping; semiconductor epitaxial layers; semiconductor growth; silicon; CMOSFET; CVD; Si; Si:C; SiGe:C; annealing; carbon atoms; diffusion; dopant activation; epitaxial growth; interstitials; localized states; strained films; substitutional concentration; Annealing; Atomic layer deposition; CMOS technology; CMOSFETs; Capacitive sensors; Epitaxial growth; Germanium silicon alloys; Semiconductor films; Silicon germanium; Strain control;
Conference_Titel :
Junction Technology (IWJT), 2010 International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5866-0
DOI :
10.1109/IWJT.2010.5474981