Title :
Investigation of capillary properties of copper metal foams by the rate of rise method in the presence of evaporation
Author :
Shirazy, Mahmood R S ; Fréchette, Luc G.
Author_Institution :
Dept. of Mech. Eng., Univ. de Sherbrooke, Sherbrooke, QC, Canada
fDate :
May 30 2012-June 1 2012
Abstract :
An experimental study has been done to define the capillary characteristics of a novel a type of copper metal foam which is to be used as a wick in flat heat pipes for electronic cooling. Capillary properties such as permeability (K) and effective pore radius (reff) are critical in defining the capillary limit of heat pipes, because their ratio (K/reff) i s a measure of pumping capacity of the wicking material. Foam strips with porosities of 68%, 75% and 82% are tested by the rate of rise method to measure K and reff. Impact of evaporation on the capillary rise has been studied by using acetone as test liquid in an open and a partially saturated ambient to reduce the evaporation rate. It was found out that the rate of evaporation while the liquid is rising is less than the evaporation rate of a saturated sample with stationary liquid. This will allow ignoring the evaporation effect in the mathematical model used to extract K and reff. By this simplification, rate of increasing of acetone and water weight with time is measured with a high precision balance and then, by using an appropriate mathematical model, K and reff are extracted. Results show that 75% porosity foam has the highest K/reff ratio which makes it a suitable candidate for a heat pipe wicking material.
Keywords :
cooling; copper; heat pipes; metal foams; acetone; capillary properties; copper metal foams; effective pore radius; electronic cooling; evaporation rate; flat heat pipes; heat pipe wicking material; mathematical model; permeability; porosity foam; pumping capacity; rate of rise method; stationary liquid; test liquid; water weight; Copper; Equations; Heating; Liquids; Mathematical model; Metal foam; capillary rise; evaporation; heat pipe; wick;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231497