Title :
Effects of variable amplitude loading on lead-free solder joint propoerties and damage accumulation
Author :
Jaradat, Yousef ; Chen, Jiann-Jong ; Owens, J.E. ; Yin, Lingzhi ; Qasaimeh, A. ; Wentlent, L. ; Arfaei, Babak ; Borgesen, P.
Author_Institution :
Dept. of Syst. Sci. & Ind. Eng., Binghamton Univ., New York, NY, USA
fDate :
May 30 2012-June 1 2012
Abstract :
Current extrapolations of accelerated test results to life in long term service may be greatly misleading when it comes to lead free solder joints. Notably, realistic service conditions are almost never well approximated by cycling with a fixed amplitude. However, recent results have demonstrated the consistent breakdown of common damage accumulation rules. In isothermal cycling tests the remaining life, after a step-down in amplitude, was invariably shorter than predicted by such a rule, while a step-up tended to have the opposite effect. The present work offers a mechanistic explanation for this and a basis for the development of a practical approach to the assessment of life under realistic service conditions. Realistic BGA joints were cycled individually in a micromechanical tester, monitoring the solder stiffness and the inelastic energy deposition. Cycling was seen to first cause rapid hardening, followed by leveling off in a “cyclic saturation” stage and eventually the initiation and growth of a crack until failure. A temporary increase in amplitude during cycling caused a lasting reduction in hardness, and thus enhanced inelastic energy deposition and damage evolution, afterwards as well. This would dominate during repeated increases and decreases, eventually shortening the remaining life dramatically.
Keywords :
ball grid arrays; cracks; failure analysis; mechanical testing; remaining life assessment; solders; accelerated test extrapolations; crack growth; cyclic saturation stage; damage accumulation; failure analysis; inelastic energy deposition; isothermal cycling tests; lead-free solder joint properties; micromechanical tester; realistic BGA joints; remaining life assessment; solder stiffness monitoring; variable amplitude loading effects; Environmentally friendly manufacturing techniques; Fatigue; Joints; Loading; Metals; Soldering; Stress; Pb-free; Reliability; damage accumulation rules; life in service; service conditions;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231501