Title :
The influence of pad geometry on ceramic ball grid array solder joint reliability
Author :
Yee, Shelgon ; Ladhar, Harjinder
Author_Institution :
Solectron Corp., Milpitas, CA, USA
Abstract :
The reliability of the solder joints on dog bone pads with hot air solder levelling (HASL) finish was found to be statistically different and less reliable than other combinations. The reliability of all other combinations was not significantly different. Both pad geometries and surface finishes evaluated in this study produced excellent, reliable solder joints. The selection of the pad geometry and surface finish will not have significant impact on CBGA solder joint reliability. Since the study was based on mechanical deflection system (MDS) test technology, the limitations for MDS will apply. Additional accelerated thermal cycling (ATC) tests to verify the conclusion will definitely be of value
Keywords :
integrated circuit packaging; integrated circuit reliability; life testing; soldering; surface mount technology; surface treatment; CBGA; accelerated thermal cycling; ceramic ball grid array; dog bone pads; hot air solder levelling; mechanical deflection system; pad geometry; solder joint reliability; surface finishes; Atherosclerosis; Ceramics; Electronic packaging thermal management; Electronics packaging; Geometry; Soldering; Surface finishing; Testing; Thermal stresses; Vehicles;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3642-9
DOI :
10.1109/IEMT.1996.559742
