• DocumentCode
    2507814
  • Title

    Modeling and simulation of the MEMS vibratory gyroscope

  • Author

    Patel, Chandradip ; McCluskey, Patrick

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    928
  • Lastpage
    933
  • Abstract
    With advances in fabrication technologies lowering cost, MEMS gyroscopes are being used in an ever wider variety of applications, including those requiring operation at/or beyond the manufacturer´s recommended temperature range. In these high temperature applications, such as deep water energy exploration and down-hole drilling, extensive lab testing is required to assess the effects of temperature on the response of a MEMS gyroscope. The objective of this paper is to develop a method to simulate the behavior of a MEMS vibratory gyroscope at various temperature conditions. The MEMS vibratory gyroscope is a two degree-of-freedom spring-mass-damper system. With known values of mass, spring stiffness and damping coefficient in the drive and sense direction, the characteristic equations of motion of the MEMS vibratory gyroscope can be solved using the first order approach developed in this paper. It is also shown, by comparing simulation results with experimental results, that this approach can accurately simulate the temperature-dependent characteristics of a MEMS vibratory gyroscope.
  • Keywords
    microfabrication; microsensors; MEMS vibratory gyroscope; damping coefficient; deep water energy exploration; degree-of-freedom spring-mass- damper system; down-hole drilling; extensive lab testing; fabrication technology; high temperature applications; spring stiffness; temperature-dependent characteristics; Damping; Drives; Equations; Force; Gyroscopes; Mathematical model; Micromechanical devices; MEMS vibratory gyroscope; harsh environment; inertial sensors; temperature effects; temperature-dependent bias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231524
  • Filename
    6231524